Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

doi:10.1016/j.cjche.2024.01.012

Chinese Journal of Chemical Engineering ›› 2024, Vol. 68 ›› Issue (4): 224-230.DOI: 10.1016/j.cjche.2024.01.012

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Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

Shuilai Qiu¹, Hang Wu², Fukai Chu², Lei Song²

1. College of Safety and Ocean Engineering, China University of Petroleum-Beijing, Beijing 102249, China;
2. State Key Laboratory of Fire Science, University of Science and Technology of China, Hefei 230026, China

Received:2023-09-21 Revised:2023-12-11 Online:2024-06-28 Published:2024-04-28
Contact: Shuilai Qiu,E-mail address:shuilai@cup.edu.cn;Lei Song,E-mail address:leisong@ustc.edu.cn
Supported by:
The work was financially supported by the Natural Science Foundation of Anhui Province (2108085QE211), National Natural Science Foundation of China (22205229) and Science Foundation of China University of Petroleum, Beijing (2462024QNXZ001).

Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

Shuilai Qiu¹, Hang Wu², Fukai Chu², Lei Song²

1. College of Safety and Ocean Engineering, China University of Petroleum-Beijing, Beijing 102249, China;
2. State Key Laboratory of Fire Science, University of Science and Technology of China, Hefei 230026, China

通讯作者: Shuilai Qiu,E-mail address:shuilai@cup.edu.cn;Lei Song,E-mail address:leisong@ustc.edu.cn
基金资助:
The work was financially supported by the Natural Science Foundation of Anhui Province (2108085QE211), National Natural Science Foundation of China (22205229) and Science Foundation of China University of Petroleum, Beijing (2462024QNXZ001).

Abstract

Abstract: Silicone rubber (SR) is widely used in the field of electronic packaging because of its low dielectric properties. In this work, the porosity of the SR was improved, and the dielectric constant of the SR foam was reduced by adding expanded microspheres (EM). Then, the thermal conductivity of the system was improved by combining the modified boron nitride (f-BN). The results showed that after the f-BN was added, the dielectric constant and dielectric loss were much lower than those of pure SR. Micron-sized modified boron nitride (f-mBN) improved the dielectric and thermal conductivity of the SR foam better than that of nano-sized modified boron nitride (f-nBN), but f-nBN improved the volume resistivity, tensile strength, and thermal stability of the SR better than f-mBN. When the mass ratio of f-mBN and f-nBN is 2:1, the thermal conductivity of the SR foam reaches the maximum value of 0.808 W·m^-1·K^-1, which is 6.5 times that before the addition. The heat release rate and fire growth index are the lowest, and the improvement in flame retardancy is mainly attributed to the high thermal stability and physical barrier of f-BN.

Key words: Foam, Composites, Dielectric properties, Thermal conductivity, Mechanical properties, Flame retardant

摘要： Silicone rubber (SR) is widely used in the field of electronic packaging because of its low dielectric properties. In this work, the porosity of the SR was improved, and the dielectric constant of the SR foam was reduced by adding expanded microspheres (EM). Then, the thermal conductivity of the system was improved by combining the modified boron nitride (f-BN). The results showed that after the f-BN was added, the dielectric constant and dielectric loss were much lower than those of pure SR. Micron-sized modified boron nitride (f-mBN) improved the dielectric and thermal conductivity of the SR foam better than that of nano-sized modified boron nitride (f-nBN), but f-nBN improved the volume resistivity, tensile strength, and thermal stability of the SR better than f-mBN. When the mass ratio of f-mBN and f-nBN is 2:1, the thermal conductivity of the SR foam reaches the maximum value of 0.808 W·m^-1·K^-1, which is 6.5 times that before the addition. The heat release rate and fire growth index are the lowest, and the improvement in flame retardancy is mainly attributed to the high thermal stability and physical barrier of f-BN.

关键词: Foam, Composites, Dielectric properties, Thermal conductivity, Mechanical properties, Flame retardant

Shuilai Qiu, Hang Wu, Fukai Chu, Lei Song. Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity[J]. Chinese Journal of Chemical Engineering, 2024, 68(4): 224-230.

Shuilai Qiu, Hang Wu, Fukai Chu, Lei Song. Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity[J]. 中国化学工程学报, 2024, 68(4): 224-230.

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Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

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