SCI和EI收录∣中国化工学会会刊

Chinese Journal of Chemical Engineering ›› 2013, Vol. 21 ›› Issue (8): 920-926.DOI: 10.1016/S1004-9541(13)60569-8

• 能源、资源与环境技术 • 上一篇    下一篇

Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion

龚志金1, 王建莉2, 吴丽梅1, 王小雨1, 吕国诚1, 廖立兵1   

  1. 1 School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China;
    2 Chemistry Institute Co., Ltd., Henan Academy of Sciences, Zhengzhou 450002, China
  • 收稿日期:2013-03-12 修回日期:2013-06-25 出版日期:2013-08-28 发布日期:2013-08-24
  • 通讯作者: LÜ Guocheng, LIAO Libing
  • 基金资助:

    Supported by the Beijing Youth Fellowship Program and the Fundamental Research Funds for the Central Universities (2011YXL056).

Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion

GONG Zhijin1, WANG Jianli2, WU Limei1, WANG Xiaoyu1, LÜ Guocheng1, LIAO Libing1   

  1. 1 School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China;
    2 Chemistry Institute Co., Ltd., Henan Academy of Sciences, Zhengzhou 450002, China
  • Received:2013-03-12 Revised:2013-06-25 Online:2013-08-28 Published:2013-08-24
  • Supported by:

    Supported by the Beijing Youth Fellowship Program and the Fundamental Research Funds for the Central Universities (2011YXL056).

摘要: Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu7S4. The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu7S4 admirably, compared with Cu, which contributes to the stable super hydrophobic surface.

关键词: super hydrophobic, copper, contact angle, molecular dynamics simulation

Abstract: Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu7S4. The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu7S4 admirably, compared with Cu, which contributes to the stable super hydrophobic surface.

Key words: super hydrophobic, copper, contact angle, molecular dynamics simulation