Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion

doi:10.1016/S1004-9541(13)60569-8

摘要/Abstract

摘要： Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu₇S₄. The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu₇S₄ admirably, compared with Cu, which contributes to the stable super hydrophobic surface.

关键词: super hydrophobic, copper, contact angle, molecular dynamics simulation

Abstract: Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu₇S₄. The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu₇S₄ admirably, compared with Cu, which contributes to the stable super hydrophobic surface.

Key words: super hydrophobic, copper, contact angle, molecular dynamics simulation

龚志金, 王建莉, 吴丽梅, 王小雨, 吕国诚, 廖立兵. Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion[J]. Chinese Journal of Chemical Engineering, 2013, 21(8): 920-926.

GONG Zhijin, WANG Jianli, WU Limei, WANG Xiaoyu, LÜ Guocheng, LIAO Libing. Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion[J]. Chin.J.Chem.Eng., 2013, 21(8): 920-926.

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