SCI和EI收录∣中国化工学会会刊

Chinese Journal of Chemical Engineering ›› 2015, Vol. 23 ›› Issue (7): 1200-1205.DOI: 10.1016/j.cjche.2014.11.034

• 能源、资源与环境技术 • 上一篇    下一篇

Fabrication of superhydrophilic surface on copper substrate by electrochemical deposition and sintering process

Qiaopeng Liu, Yong Tang, Wenjie Luo, Ting Fu, Wei Yuan   

  1. College of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China
  • 收稿日期:2014-04-29 修回日期:2014-11-23 出版日期:2015-07-28 发布日期:2015-08-21
  • 通讯作者: Qiaopeng Liu, Yong Tang
  • 基金资助:

    Supported by the National Natural Science Foundation of China (51275180), the Fundamental Research Funds for the Central Universities (2013ZM0003) and the Doctorate Dissertation Funds of Guangdong Province (sybzzxm 201213).

Fabrication of superhydrophilic surface on copper substrate by electrochemical deposition and sintering process

Qiaopeng Liu, Yong Tang, Wenjie Luo, Ting Fu, Wei Yuan   

  1. College of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China
  • Received:2014-04-29 Revised:2014-11-23 Online:2015-07-28 Published:2015-08-21
  • Contact: Qiaopeng Liu, Yong Tang
  • Supported by:

    Supported by the National Natural Science Foundation of China (51275180), the Fundamental Research Funds for the Central Universities (2013ZM0003) and the Doctorate Dissertation Funds of Guangdong Province (sybzzxm 201213).

摘要: Superhydrophilic surfaces were fabricated on copper substrates by an electrochemical deposition and sintering process. Superhydrophobic surfaces were prepared by constructing micro/nano-structure on copper substrates through an electrochemical deposition method. Conversion fromsuperhydrophobic to superhydrophilic was obtained via a suitable sintering process. After reduction sintering, the contact angle of the superhydrophilic surfaces changed from 155° to 0°. The scanning electron microscope (SEM) images show that the morphology of superhydrophobic and superhydrophilic surfaces looks like corals and cells respectively. The chemical composition and crystal structure of these surfaceswere examined using energy dispersive spectrometry (EDS) and X-ray diffraction (XRD). The results show that the main components on superhydrophobic surfaces are Cu, Cu2O and CuO, while the superhydrophilic surfaces are composed of Cu merely. The crystal structure is more inerratic and the grain size becomes bigger after the sintering. The interfacial strength of the superhydrophilic surfaces was investigated, showing that the interfacial strength between superhydrophilic layer and copper substrate is considerably high.

关键词: Superhydrophilic, Superhydrophobic, Copper surface, Electrochemical deposition, Sintering process

Abstract: Superhydrophilic surfaces were fabricated on copper substrates by an electrochemical deposition and sintering process. Superhydrophobic surfaces were prepared by constructing micro/nano-structure on copper substrates through an electrochemical deposition method. Conversion fromsuperhydrophobic to superhydrophilic was obtained via a suitable sintering process. After reduction sintering, the contact angle of the superhydrophilic surfaces changed from 155° to 0°. The scanning electron microscope (SEM) images show that the morphology of superhydrophobic and superhydrophilic surfaces looks like corals and cells respectively. The chemical composition and crystal structure of these surfaceswere examined using energy dispersive spectrometry (EDS) and X-ray diffraction (XRD). The results show that the main components on superhydrophobic surfaces are Cu, Cu2O and CuO, while the superhydrophilic surfaces are composed of Cu merely. The crystal structure is more inerratic and the grain size becomes bigger after the sintering. The interfacial strength of the superhydrophilic surfaces was investigated, showing that the interfacial strength between superhydrophilic layer and copper substrate is considerably high.

Key words: Superhydrophilic, Superhydrophobic, Copper surface, Electrochemical deposition, Sintering process