SCI和EI收录∣中国化工学会会刊

Chinese Journal of Chemical Engineering ›› 2015, Vol. 23 ›› Issue (7): 1161-1168.DOI: 10.1016/j.cjche.2015.05.010

• 过程系统工程与过程安全 • 上一篇    下一篇

Optimization of volume to point conduction problem based on a novel thermal conductivity discretization algorithm

Wenjing Du1,2, Peili Wang1,2, Lipeng Song1, Lin Cheng1   

  1. 1 Institute of Thermal Science & Technology, Shandong University, Jinan 250061, China;
    2 Department of Energy and Power Engineering, Shandong University, Jinan 250061, China
  • 收稿日期:2015-03-13 修回日期:2015-05-08 出版日期:2015-07-28 发布日期:2015-08-21
  • 通讯作者: Lin Cheng
  • 基金资助:

    Supported by the National Key Basic Research Program of China (2013CB228305).

Optimization of volume to point conduction problem based on a novel thermal conductivity discretization algorithm

Wenjing Du1,2, Peili Wang1,2, Lipeng Song1, Lin Cheng1   

  1. 1 Institute of Thermal Science & Technology, Shandong University, Jinan 250061, China;
    2 Department of Energy and Power Engineering, Shandong University, Jinan 250061, China
  • Received:2015-03-13 Revised:2015-05-08 Online:2015-07-28 Published:2015-08-21
  • Contact: Lin Cheng
  • Supported by:

    Supported by the National Key Basic Research Program of China (2013CB228305).

摘要: A conduction heat transfer process is enhanced by filling prescribed quantity and optimized-shaped high thermal conductivity materials to the substrate. Numerical simulations and analyses are performed on a volume to point conduction problem based on the principle of minimum entropy generation. In the optimization, the arrangement of high thermal conductivity materials is variable, the quantity of high thermal-conductivity material is constrained, and the objective is to obtain the maximum heat conduction rate as the entropy is the minimum. A novel algorithm of thermal conductivity discretization is proposed based on large quantity of calculations. Compared with other algorithms in literature, the average temperature in the substrate by the new algorithm is lower, while the highest temperature in the substrate is in a reasonable range. Thus the new algorithm is feasible. The optimization of volume to point heat conduction is carried out in a rectangular model with radiation boundary condition and constant surface temperature boundary condition. The results demonstrate that the algorithm of thermal conductivity discretization is applicable for volume to point heat conduction problems.

关键词: Volume to point conduction, Principle of minimum entropy generation, Algorithm of thermal conductivity discretization, Optimization

Abstract: A conduction heat transfer process is enhanced by filling prescribed quantity and optimized-shaped high thermal conductivity materials to the substrate. Numerical simulations and analyses are performed on a volume to point conduction problem based on the principle of minimum entropy generation. In the optimization, the arrangement of high thermal conductivity materials is variable, the quantity of high thermal-conductivity material is constrained, and the objective is to obtain the maximum heat conduction rate as the entropy is the minimum. A novel algorithm of thermal conductivity discretization is proposed based on large quantity of calculations. Compared with other algorithms in literature, the average temperature in the substrate by the new algorithm is lower, while the highest temperature in the substrate is in a reasonable range. Thus the new algorithm is feasible. The optimization of volume to point heat conduction is carried out in a rectangular model with radiation boundary condition and constant surface temperature boundary condition. The results demonstrate that the algorithm of thermal conductivity discretization is applicable for volume to point heat conduction problems.

Key words: Volume to point conduction, Principle of minimum entropy generation, Algorithm of thermal conductivity discretization, Optimization